WE DO NOT KNOW HOW TO VERIFY ALL OF THE SPEC BELOW. 329-BDDU : Dell Wyse Legacy, Z50S. MANAGER, 4.0X6.0, 10D. CARD (CIRCUIT), WIRELESS, 802.11ABGN, PERIPHERAL COMPONENT INTERCONNECT EXPRESS, Z00X. ASSEMBLY, PRINTED WIRING ASSY, PLANAR (MOTHERBOARD), 1.5GHZ, C0/E1, Z00S.
ADAPTER, CONNECTOR, DVI/VGA, BLACK, ZX0/TX0. PAD, THERMAL, RIGHT, 8X40X0.75MM, ZX0. MANAGER, 1.6X4, 3.0D.
DUAL IN-LINE MEMORY MODULE, 2GB, 1333, UDIMM, DDR3, Z00S. KIT, MOUSE, UNIVERSAL SERIAL BUS, POINT OF SALE, PRIMAX ELECTRONICS LTD, MS111. ASSEMBLY, CARD (CIRCUIT), INTERFACE, Serial ATA, 4GB, XN0M. DUAL IN-LINE MEMORY MODULE, 2GB, 1333, DDR3, 128X16, Z50.CORD, POWER, 250V, 2.5A, 1.8M, AUSTRALIA NEW ZEALAND. PAD, THERMAL, CENTRAL PROCESSOR UNIT, 15X15X1MM, DX0D.
PANEL, BACK, METAL, INPUT/OUTPUT, RJ45+2S1P, 7010. WASHER, FLAT, 10.2MM, THKN, BRASS, WYSE. ADAPTER, ALTERNATING CURRENT, 65W, 19V, ENERGY STAR, AIR PRODUCTS & CHEMICALS, INC. ASSEMBLY, CARD (CIRCUIT), INTERFACE, SATA3, 8GB, MLC.
COVER, PROTECTION, ANTENNA, EXTERNAL, POLYVINYL CHLORIDE, THNC. ASSEMBLY, STAND, VERTICAL, W/SCRWS, 7010/20. DUAL IN-LINE MEMORY MODULE, 2GB, 1600, UDIMM, DDR3, THNC. ASSEMBLY, CABLE, PPRT, INTERNAL, 7010. ASSEMBLY, CHASSIS, RIGHT, W/LOGO, ZX0. SCREW, CBM AMERICA CORPORATION, 3.0X6.0, BLACK. ASSEMBLY, ANTENNA, EXTERNAL, DIPOLE, DRIW, WYSE. ASSEMBLY, SPEAKER, 2W, 18MM, TX0/Z90D7. ASSEMBLY, BEZEL, FRONT, PLASTIC, W/LOGO, ZX0. MANAGER, 2.5X6, 4.5D.ASSEMBLY, CARD (CIRCUIT), INTERFACE, Serial ATA, 2GB, DX0D. MANAGER, 2X2.5, 4.5D. ANTENNA, CABLE, WIRELESS, INTERNAL, 200MM, DX0D.
DUAL IN-LINE MEMORY MODULE, 2GB, 1333, UDIMM, DDR3, Z50S. SCREW, THMB, M4X16, STAND, VIEWER RUN TIME, DX0D. ASSEMBLY, CARD (CIRCUIT), INTERFACE, Serial ATA, 8GB, XN0M. DUAL IN-LINE MEMORY MODULE, 4GB, 1333, DDR3, AP/HY, Z50.
KEYBOARD, 104, UNITED STATES, KB212B, W8, PRIMAX ELECTRONICS LTD. COVER, HOLE, ANTENNA, EXTERNAL, NYLON, THNC. SCREW, THMB, M4X16, STAND, HOR, DX0D.
DUAL IN-LINE MEMORY MODULE, 4GB, 1333, DDR3, AP/EL, Z50. CARD (CIRCUIT), WIRELESS, 802.11ABGN, UNIVERSAL SERIAL BUS, XN0M. BRACKET, MATERIAL, WIRELESS LOCAL AREA NETWORK CARD, MINI PCI CARD, THNC.
ASSEMBLY, ANTENNA, EXTERNAL, DIPOLE, THNC. ASSEMBLY, PRINTED WIRING ASSY, DAUGHTER, INPUT/OUTPUT, SER/PRL, 7010. ASSEMBLY, CABLE, INPUT/OUTPUT, INTERNAL, 7010.MANAGER, 2.0X6, 4.5D. SCREW, HEXHEAD, 4-40X4-40, STANDOFF, STEEL. MANAGER, 2X4, 4.5D, 0.8T, BZN, PATRON. ASSEMBLY, CHASSIS, LFT, W/LOGO, ZX0. NUT, HEXHEAD, 1/4-32, UNC, 1.6MM, WYSE.
PANEL, BACK, METAL, INPUT/OUTPUT, ZX0. CORD, POWER, 125V, 2.5A, 1.8M, UNITED STATES. ADHESIVE, THERM, HEATSINK, CENTRAL PROCESSOR UNIT, 1G, WYSE. INSULATOR/INSULATION, INTERNAL, ANTENNA, TEFLON, TYPE 1, WHITE, WYSE. DUAL IN-LINE MEMORY MODULE, 4GB, 1600, UDIMM, DDR3, THNC.
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